描述： The VD90.5105 is a lead-free Solder Sphere optimal to use for reballing of BGA and CSP chips. It"s material composition equals standard alloys in electric manufacturing (lead free: Sn96,5Ag3Cu0,5). Hence, processes parameter for i.e. reflow can be used for reballed SMDs in same manner as for new ones. As a result of a special and unique manufacturing procedures, solder spheres have best surface quality and repeatable sphere shape. Both are important parameter for easy usage with stencils and stable reballing processes. To keep the wetting properties at its best, also on the used pads, MARTIN solder spheres are packed, stored and delivered under dry and inert (oxygen free) Argon gas. By this the creation of the unwanted oxide onto the sphere surfaces is suppressed, Therefore the number of voids is little in solder joints and the electrical properties are very good. . ±10µm tolerance . 99.9% purity

VD90.5106

描述： The VD90.5106 is a lead-free Solder Sphere optimal to use for reballing of BGA and CSP chips. It"s material composition equals standard alloys in electric manufacturing (lead free: Sn96,5Ag3Cu0,5). Hence, processes parameter for i.e. reflow can be used for reballed SMDs in same manner as for new ones. As a result of a special and unique manufacturing procedures, solder spheres have best surface quality and repeatable sphere shape. Both are important parameter for easy usage with stencils and stable reballing processes. To keep the wetting properties at its best, also on the used pads, MARTIN solder spheres are packed, stored and delivered under dry and inert (oxygen free) Argon gas. By this the creation of the unwanted oxide onto the sphere surfaces is suppressed, Therefore the number of voids is little in solder joints and the electrical properties are very good. . ±10µm tolerance . 99.9% purity

VD90.5004

描述： The VD90.5004 is a leaded Solder Sphere optimal to use for reballing of BGA and CSP chips. It"s material composition equals standard alloys in electric manufacturing (leaded: Sn63Pb37). Hence, processes parameter for i.e. reflow can be used for reballed SMDs in same manner as for new ones. As a result of a special and unique manufacturing procedures, solder spheres have best surface quality and repeatable sphere shape. Both are important parameter for easy usage with stencils and stable reballing processes. To keep the wetting properties at its best, also on the used pads, MARTIN solder spheres are packed, stored and delivered under dry and inert (oxygen free) Argon gas. By this the creation of the unwanted oxide onto the sphere surfaces is suppressed, Therefore the number of voids is little in solder joints and the electrical properties are very good. . Compatible with leaded and lead-free alloys . 99.9% purity

VD90.5008

描述： The VD90.5008 is a leaded Solder Sphere optimal to use for reballing of BGA and CSP chips. It"s material composition equals standard alloys in electric manufacturing (leaded: Sn63Pb37). Hence, processes parameter for i.e. reflow can be used for reballed SMDs in same manner as for new ones. As a result of a special and unique manufacturing procedures, solder spheres have best surface quality and repeatable sphere shape. Both are important parameter for easy usage with stencils and stable reballing processes. To keep the wetting properties at its best, also on the used pads, MARTIN solder spheres are packed, stored and delivered under dry and inert (oxygen free) Argon gas. By this the creation of the unwanted oxide onto the sphere surfaces is suppressed, Therefore the number of voids is little in solder joints and the electrical properties are very good. . ±10µm tolerance . 99.9% purity

VD90.5010

描述： The VD90.5010 is a leaded Solder Sphere optimal to use for reballing of BGA and CSP chips. It"s material composition equals standard alloys in electric manufacturing (leaded: Sn63Pb37). Hence, processes parameter for i.e. reflow can be used for reballed SMDs in same manner as for new ones. As a result of a special and unique manufacturing procedures, solder spheres have best surface quality and repeatable sphere shape. Both are important parameter for easy usage with stencils and stable reballing processes. To keep the wetting properties at its best, also on the used pads, MARTIN solder spheres are packed, stored and delivered under dry and inert (oxygen free) Argon gas. By this the creation of the unwanted oxide onto the sphere surfaces is suppressed, Therefore the number of voids is little in solder joints and the electrical properties are very good. . ±10µm tolerance . 99.9% purity

描述：清洁笔,PCB,3块擦除器,用于垫与红外玻璃

10032

描述： Standoffs & Spacers HSP3-12 NATURAL

LW01.0400

VD90.5101

描述： SOLDER BALLS96.530.5183 DEG762UM

VD90.5006

描述： The VD90.5006 is a leaded Solder Sphere optimal to use for reballing of BGA and CSP chips. It"s material composition equals standard alloys in electric manufacturing (leaded: Sn63Pb37). Hence, processes parameter for i.e. reflow can be used for reballed SMDs in same manner as for new ones. As a result of a special and unique manufacturing procedures, solder spheres have best surface quality and repeatable sphere shape. Both are important parameter for easy usage with stencils and stable reballing processes. To keep the wetting properties at its best, also on the used pads, MARTIN solder spheres are packed, stored and delivered under dry and inert (oxygen free) Argon gas. By this the creation of the unwanted oxide onto the sphere surfaces is suppressed, Therefore the number of voids is little in solder joints and the electrical properties are very good. . Compliant to Bellcore GR-78 . 99.9% purity

LW40.0500

描述： The LW40.0500 is a Reballing Frame Kit suitable for use with 04S mini oven.

LW40.0438

LW50.9001

10222

描述： The 10222 is a M8 x 50 Levelling Feet with black polyamide base reinforced by fibreglass and articulated galvanised iron screw. . 30° Articulated screw . 10000N Maximum load

LW40.1024

LW40.0252

MARTIN

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