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基于Qualcomm QCC3003 Flash版无线立体声耳机芯片的蓝牙公网对讲机解决方案

来源: 大大通
2018-11-28
类别:消费电子
eye 1637
文章创建人 拍明

原标题:基于Qualcomm QCC3003的蓝牙公网对讲机方案

  

  本方案是基于QCC3003方案的无线蓝牙对讲耳机的解决方案,QCC3003是Qualcomm推出的一款高性能Flash版的无线立体声耳机芯片, 支持cVc降噪和回声消除技术。这款耳机可以通过BT与手机连接,通过QCC3003自带的BLE控制讲话的通断,然后经过手机与公网连接,同时可以通过使用手机上的App建立联系人群组,这样,就可以实现通过耳机和组群内的人员实现对讲通话功能,相比于手机通话,这种通话方式不会产生运营商费用。

  场景应用图

场景应用图.png

  展示板照片

展示板照片.png

展示板照片.png

  方案方块图

方案方块图.png

  核心技术优势

  1、支持cVc降噪和回声消除;

  2、通过BT实现连接,连接更方便;

  3、免费通话;

  4、支持手机App建立通话群组,建立连接更加方便;

  5、通过BLE控制讲话通断;

  方案规格

  1、高性能的RF性能,接收灵敏度到达-89dBm(典型值);

  2、支持外挂Flash;

  3、Stereo Codec,Stereo line input;

  4、SBC and AAC audio codecs support;

  5、1-mic cVc headset NR/EC

  技术文档

类别标题档案
硬件Datasheet

22339_OTHERFILE_20180706150525.pdf

  【QCC3003】

  Device description

  ■QCC3003 stereo flash programmable solution

  ■1-mic Qualcomm® cVc™ headset noise reduction and echo cancellation technology

  ■Fully qualified single-chip dual mode Bluetooth® v5.0 system

  Applications

  ■Stereo headsets

  ■Wired stereo headsets and headphones

  Features

  ■Radio includes integrated balun with RF performance of 9 dBm (typ) transmit power and-89 dBm (typ) basic rate receiver sensitivity

  ■80 MHz RISC CPU and80 MHz Qualcomm® Kalimba™ DSP

  ■On-chip ROM, RAM, and external QSPI flash memory

  ■Link Layer and Dual Mode Topologies

  ■Over the air updates of external Flash partitions

  ■Wideband speech support

  ■Stereo Codec

  ■Stereo line input

  ■SBC and AAC audio codecs support

  ■1-mic cVc headset NR/EC

  ■Bluetooth HID remote camera control

  ■Audio interfaces: I²S and PCM, analog and digital microphone

  ■Fully configurable EQ: 6 banks for music enhancement; 1 bank for speaker

  ■Serial interfaces: UART, USB 2.0, and I²C

  ■Integrated dual switch-mode regulators, linear regulators, and battery charger

  ■52-lead QFN 6 × 6 × 0.6 mm0.4 mm pitch

  ■Green (RoHS compliant and no antinomy or halogenated flame retardants)

  System architecture

QCC30039.png

  General description

  The QCC3003 QFN is a single-chip flash programmable dual mode Bluetooth v5.0 device with integrated application processor, low-power audio DSP, on-chip ROM and RAM, stereo codec, battery charger, switch-mode and linear regulators, and LED drivers.

  The QCC3003 QFN on-chip ROM includes Bluetooth HCI lower and upper stack, and the audio DSP application with the end product application and user interface in external flash programmable memory.

  The QCC3003 QFN device, the 1-mic stereo headset application (binary image and source code), IDE, and configuration tools provide a flexible and powerful platform for developing Bluetooth audio products with fast time to market.

  Device details

  Dual mode Bluetooth radio

  ■On-chip balun (50 Ω impedance)

  ■No production trimming of external components

  ■Bluetooth v5.0 specification compliant

  Bluetooth transmitter

  ■9 dBm (typ) RF transmit power

  Bluetooth receiver

  ■-91.0 dBm (typ) π/4 DQPSK receiver sensitivity and -81.0 dBm (typ) 8DPSK receiver sensitivity

  ■Integrated channel filters

  ■Digital demodulator for improved sensitivity and cochannel rejection

  ■Real-time digitized RSSI available to application

  ■Fast AGC for enhanced dynamic range

  ■Channel classification for AFH

  Bluetooth synthesizer

  ■Fully integrated synthesizer requires no external VCO, varactor diode, resonator, or loop filter

  ■Compatible with crystals 16 MHz to 32 MHz

  Kalimba DSP

  ■Enhanced Kalimba DSP coprocessor, 80 MHz, 24‑bit fixed-point core

  ■2 single-cycle MACs: 24 × 24‑bit multiply and 56‑bit accumulator

  ■32‑bit instruction word, dual 24‑bit data memory

  ■6 K × 32‑bit program RAM including 1 K instruction cache for executing out of internal ROM

  ■16 K × 24‑bit + 16 K × 24‑bit 2-bank data RAM

  Audio interfaces

  ■I²S output

  ■PCM/I²S input

  ■USB audio

  ■Stereo audio ADC with line input, stereo audio DAC

  ■Supported sample rates of 8, 11.025, 16, 22.05, 32, 44.1, and

  48 kHz

  Auxiliary features

  ■Crystal oscillator with built-in digital trimming

  Physical interfaces

  ■UART interface

  ■USB 2.0 (full-speed) interface, including USB charger detection

  ■4‑bit SPI flash memory interface

  ■SPI interface for debug and programming

  ■I²C master support

  ■Up to 10 general-purpose PIOs

  ■3 LED drivers with PWM flasher independent of MCU

  Integrated power control regulation

  ■2 high-efficiency switch-mode regulators with 1.8 V and 1.35 V outputs direct from battery supply

  ■3.3 V linear regulator for USB supply

  ■Low-voltage linear regulator for internal digital circuits

  ■Low-voltage linear regulator for internal analog circuits

  ■Power-on-reset detects low supply voltage

  ■Power management for ultralow power modes

  Battery charger

  ■Lithium ion / Lithium polymer battery charger

  ■Charger supports 4.20 V and 4.35 V cells

  ■Instant-on function automatically selects the power supply between battery and USB, which enables operation even if the battery is fully discharged

  ■Fast charging support

  □Up to 200 mA with no external components

  ■Supports USB charger detection

  ■Support for thermistor protection of battery pack

  ■Support to enable end product design to PSE law:

  □Design to JIS-C 8712/8714 (batteries)

  □Testing based on IEEE 1725

  Baseband software

  ■Fully qualified under HCI and upper layer stack in on-chip ROM

  QCC3003 stereo flash solution details

  Bluetooth features

  ■Bluetooth v5.0 specification support

  ■Qualcomm® Bluetooth® Low Energy secure connection

  ■A2DP v1.3.1

  ■AVRCP v1.6

  ■HFP v1.7

  ■HSP v1.2

  ■SPP v1.2

  ■DID v1.3

  ■HID v1.1

  ■PXP v1.0.1

  ■FMP v1.0

  ■BAS v1.0

  ■QTIL's proximity pairing and QTIL's proximity connection

  Audio features

  ■SBC and AAC audio codecs

  ■Qualcomm ShareMe, which allows the sharing of audio from QCC3003 to another Bluetooth A2DP sink device

  ■Configurable Signal Detection to trigger events

  ■1 bank of up to 10-stage Speaker Parametric EQ

  ■6 banks of up to 5-stage User Parametric EQ for music enhancement

  ■Qualcomm® meloD™ Expansion audio processing: 3D stereo widening

  ■Compander to compress or expand the dynamic range of the audio

  ■Post Mastering to improve DAC fidelity

  ■I²S input/output

  ADK configuration tool

  Configures the QCC3003 stereo flash solution software features:

  ■Bluetooth features

  ■Audio features

  ■Reconnection policies

  ■Button events

  ■LED indications

  ■Indication tones and audio prompts

  ■Battery divider ratios and thresholds

  ■Advanced Multipoint settings

  QCC300x ADK software development kit

  ■Includes application source code

  ■Allows development and debug of customer application

  QCC3003 development kit

  ■Example QCC3003 QFN module design

  ■Carrier board

  ■Headphone amplifier board

  ■Interface adapters and cables

  Additional functionality

  ■Support for multi-language programmable audio prompts

  ■Multipoint support for A2DP connection to 2 A2DP sources for music playback

  ■Talk-time extension, which automatically reduces processor functions to extend use when a low battery condition is detected


责任编辑:David

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