原标题：Microchip BM64蓝牙4.2立体声音频模块解决方案

　　microchip公司的BM62/BM64立体声音频模块是完全合格的蓝牙4.2双模式模块,能在产品中增加无线音频和语音应用.支持HFP 1.6, HSP 1.2, A2DP 1.3, SPP 1.2,AVRCP 1.6, 支持蓝牙(BR/EDR/BLE)指标,支持分辨率高达24位96kHz音频数据格式,频率范围 2.402 GHz到2.480 GHz,接收灵敏度-90 dBm (2 Mbps EDR),BM64输出功率+15dBm,支持64 kbps A律和u律PCM 格式/连续可变斜率增量调制(CVSD),主要用在条形音箱和超低音音箱,蓝牙扬声器和多个扬声器.本文介绍了BM64主要特性,多种应用框图,BM64评估板(EVB)主要特性和主要元件以及电路图.

　　The BM62/64 Stereo Audio module is a fully qualifiedBluetooth 4.2 dual-mode module for designers to addwireless audio and voice applications to their products.

　　The BM62/64 module is a Bluetooth Special InterestGroup (SIG) certified module that provides a completewireless solution with Bluetooth stack, integrated PCBantenna, and worldwide radio certifications in acompact surface-mount package.

　　The BM62/64 module has several SKUs. The BM62 isa Class 2 device and the BM64 is available in bothClass 1 and Class 2 versions.

　　BM64主要特性:

　　• Qualified for Bluetooth v4.2 specifications

　　• Worldwide regulatory certifications are planned

　　• Supports HFP 1.6, HSP 1.2, A2DP 1.3, SPP 1.2,AVRCP 1.6

　　• Supports Bluetooth (BR/EDR/BLE) specifications(FW dependent)

　　• Stand-alone module with on-board PCB antennaand Bluetooth stack

　　• Supports high resolution up to 24-bit, 96 kHzaudio data format

　　• Supports to connect two hosts with HFP/A2DPprofiles simultaneously

　　• Transparent UART mode for seamless serial dataover UART interface

　　• Supports virtual UART cable transport betweenhost MCU and smartphone applications by BluetoothSPP or BLE link

　　• Easy to configure with Windows® GUI or directlyby external MCU

　　• Supports firmware field upgrade

　　• Supports 1 microphone

　　• Compact surface mount module:

　　- BM62: 29 x 15 x 2.5 mm

　　- BM64: 32 x 15 x 2.5 mm

　　• Castellated surface mount pads for easy andreliable host PCB mounting

　　• RoHS compliant

　　• Ideal for portable battery operated devices

　　• Internal battery regulator circuitry

　　RF/Analog

　　• Frequency spectrum: 2.402 GHz to 2.480 GHz

　　• Receive sensitivity: -90 dBm (2 Mbps EDR)

　　• Class 2 output power (+2 dBm typical) for BM62,BM64 and Class 1 output power (+15 dBm typical)for BM64

　　DSP Audio Processing

　　• Supports 64 kbps A-Law, u-Law PCM format/Continuous Variable Slope Delta (CVSD) Modulationfor SCO channel operation

　　• Supports 8/16 kHz noise suppression

　　• Supports 8/16 kHz echo cancellation

　　• SBC and optional AAC decoding

　　• Packet loss concealment (PLC)

　　• Supports Serial Copy Management System(SCMS-T) content protection

　　Audio Codec

　　• SBC and optional AAC decoding

　　• 20-bit digital-to-analog (DAC) with 96 dB SNR

　　• 16-bit analog-to-digital (ADC) with 90 dB SNR

　　• Up to 24-bit, 96 kHz I2S digital audio

　　Peripherals

　　• Built-in lithium-ion and lithium-polymer batterycharger (up to 350 mA)

　　• Integrated 1.8V and 3V configurable switchingregulator and low-dropout (LDO)

　　• Built-in ADC for battery monitoring and voltagesense

　　• Built-in ADC for charger thermal protection

　　• Built-in undervoltage protection (UVP)

　　• An AUX-In port for external audio input

　　• Two LED drivers

　　• Multiple I/O pins for control and status

　　HCI Interface

　　• High-speed HCI-UART interface (supports up to921,600 bps)

　　MAC/Baseband Processor

　　• Supports Bluetooth 4.2 dual mode (FW dependent)

　　- BR/EDR transport for audio, voice, and SPPdata exchange

　　- BLE transport for proprietary transparentservice and ANCS data exchange

　　Operating Condition

　　• Operating voltage: 3.2V to 4.2V

　　• Operating temperature: -20℃ to +70℃

　　Compliance

　　• Bluetooth SIG QDID: 83345 (BM62, BM64 Class2) and 83336 (BM64 Class 1)

　　• Certifications planned for the United States(FCC), Canada (IC), European Economic Area(CE), Korea (KCC), Taiwan (NCC), Japan (JRF),and China (SRRC)

　　BM64应用:

　　• Soundbar and Subwoofer

　　• Bluetooth speaker

　　• Multi-speaker

　　图1.BM64模块应用框图

　　图2.BM64模块条形音箱和超低音音箱应用框图

　　图3.采用BM64和智能手机的条形音箱和超低音音箱应用框图

　　图4.BM64模块多扬声器应用框图

　　图5.BM64模块立体声耳机参考电路

　　图6.用于立体声耳机的BM64参考电路(1)

　　图7.用于立体声耳机的BM64参考电路(2)

　　BM64评估板(EVB)

　　The BM64 EVB enables the user to evaluate and demonstrate the functionalities of the

　　BM64 module. The BM64 EVB includes status LEDs and an integrated configurationand programming interface for plug-and-play capability, which enables rapidprototyping and faster time to market.

　　Along with the BM64 EVB, software tools and applications are provided to demonstrate

　　the Bluetooth connections to the on-board BM64 module with options for configuring or

　　programming it.

　　The BM64 EVB kit includes the following items:

　　• One BM64 EVB, which contains the BM64SPKS1MC1 module

　　• One micro-USB cable

　　• One 15V DC power adapter

　　• Two speaker cables

　　图8.BM64评估板(EVB)套件外形图

　　BM64评估板(EVB)主要特性:

　　• The BM64 EVB includes a BM64 module, qualified for Bluetooth 4.2 specifications

　　• On-board MCU (PIC18F85J10) and DSP (YDA174) for easy operation andfeature demonstration

　　• On-board keypad matrix that is controlled by MCU, which makes it easy forplayback control

　　• Built-in Near Field Communication (NFC)

　　• RoHS compliant

　　图9.BM64评估板(EVB)顶层外形图

　　图9中的数字对应下面的元件:

　　1. BM64SPKS1MC1 module

　　2. Three status LEDs

　　3. NFC tag

　　4. Mode switch (SW9)

　　5. USB connector (P9)

　　6. USB to UART converter (MCP2200)

　　7. UART port over USB connector (P3)

　　8. MCU (PIC18F85J10)

　　9. ICSP header (J5)

　　10. Audio control buttons, Multi-Function Button (MFB) and pairing mode button

　　11. 15V adapter jack (P2)

　　12. Internal/External MCU selection switch (SW46)

　　13. Internal/External DSP selection switch (SW47)

　　14. On-board DSP (YDA174) with built-in audio amplifier

　　15. Audio connector (CN1 and CN2)

　　16. External MCU/DSP header (J6)

　　17. Auxiliary input 3.5 mm jack (P8)

　　18. Microphone input 3.5 mm jack (P6)

　　19. Speaker output 3.5 mm jack (P7)

　　20. Reset button for BM64 module (SW10)

　　21. Reset button for MCU (SW1)

　　详情请见:

60001403A.pdf

50002514A.pdf