原标题：Lattice ECP5-5G系列FPGA视频接口协议(VIP)开发方案

　　lattice公司的ECP5/ECP5-5G系列FPGA具有超过84K查找表(LUT)逻辑元件,支持个用户I/O,提供高达156个18x18乘法器和各种并行I/O标准,提供高性能的增强DSP架构,高速SERDES和高速源同步接口,采用40nm工艺技术,主要用在量大高速低成本的应用.本文介绍了ECP5/ECP5-5G系列FPGA主要特性,LFE5UM/LFE5UM5G-85器件简化框图以及视频接口协议(VIP)处理器板主要特性,框图,电路图和材料清单.

　　The ECP5/ECP5-5G family of FPGA devices is optimized to deliver high performance features such as an enhanced DSP architecture, high speed SERDES and high speed source synchronous interfaces in an economical FPGA fabric. This combination is achieved through advances in device architecture and the use of 40 nm technology making the devices suitable for high-volume, high-speed, low-cost applications.

　　The ECP5/ECP5-5G device family covers look-up-table (LUT) capacity to 84K logic elements and supports up to 365 user I/Os. The ECP5/ECP5-5G device family also offers up to 156 18 x 18 multipliers and a wide range of parallel I/O standards.

　　The ECP5/ECP5-5G FPGA fabric is optimized high performance with low power and low cost in mind. The ECP5/ ECP5-5G devices utilize reconfigurable SRAM logic technology and provide popular building blocks such as LUT-based logic, distributed and embedded memory, Phase Locked Loops (PLLs), Delay Locked Loops (DLLs), pre-engineered source synchronous I/O support, enhanced sysDSP slices and advanced configuration support, including encryption and dual-boot capabilities.

　　The pre-engineered source synchronous logic implemented in the ECP5/ECP5-5G device family supports a broad range of interface standards, including DDR2/3, LPDDR2/3, XGMII and 7:1 LVDS.

　　The ECP5/ECP5-5G device family also features high speed SERDES with dedicated Physical Coding Sublayer (PCS) functions. High jitter tolerance and low transmit jitter allow the SERDES plus PCS blocks to be configured to support an array of popular data protocols including PCI Express, Ethernet (XAUI, GbE, and SGMII) and CPRI. Transmit De-emphasis with pre- and post-cursors, and Receive Equalization settings make the SERDES suitable for transmission and reception over various forms of media.

　　The ECP5/ECP5-5G devices also provide flexible, reliable and secure configuration options, such as dual-boot capability, bit-stream encryption, and TransFR field upgrade features.ECP5-5G family devices have made some enhancement in the SERDES compared to ECP5UM devices. These enhancements increase the performance of the SERDES to up to 5 Gb/s data rate.

　　The ECP5-5G family devices are pin-to-pin compatible with the ECP5UM devices. These allows a migration path for users to port designs from ECP5UM to ECP5-5G devices to get higher performance.

　　The Lattice Diamond™ design software allows large complex designs to be efficiently implemented using the ECP5/ECP5-5G FPGA family. Synthesis library support for ECP5/ECP5-5G devices is available for popular logic synthesis tools. The Diamond tools use the synthesis tool output along with the constraints from its floor planning tools to place and route the design in the ECP5/ECP5-5G device. The tools extract the timing from the routing and back-annotate it into the design for timing verification.

　　Lattice provides many pre-engineered IP (Intellectual Property) modules for the ECP5/ECP5-5G family. By using these configurable soft core IPs as standardized blocks, designers are free to concentrate on the unique aspects of their design, increasing their productivity.

　　ECP5/ECP5-5G系列主要特性:

　　• Higher Logic Density for Increased System Integration

　　• 12K to 84K LUTs

　　• 197 to 365 user programmable I/Os

　　• Embedded SERDES

　　• 270 Mb/s, up to 3.2 Gb/s, SERDES interface (ECP5)

　　• 270 Mb/s, up to 5.0 Gb/s, SERDES interface (ECP5-5G)

　　• Supports eDP in RDR (1.62 Gb/s) and HDR (2.7 Gb/s)

　　• Up to four channels per device: PCI Express, Ethernet (1GbE, SGMII, XAUI), and CPRI

　　• sysDSP™

　　• Fully cascadable slice architecture

　　• 12 to 160 slices for high performance multiply and accumulate

　　• Powerful 54-bit ALU operations

　　• Time Division Multiplexing MAC Sharing

　　• Rounding and truncation

　　• Each slice supports • Half 36 x 36, two 18 x 18 or four 9 x 9 multipliers

　　• Advanced 18 x 36 MAC and 18 x 18 Multiply-Multiply-Accumulate (MMAC) operations

　　• Flexible Memory Resources

　　• Up to 3.744 Mb sysMEM™ Embedded Block RAM (EBR)

　　• 194K to 669K bits distributed RAM

　　• sysCLOCK Analog PLLs and DLLs

　　• Four DLLs and four PLLs in LFE5-45 and LFE5-85; two DLLs and two PLLs in LFE5-25 and LFE5-12

　　• Pre-Engineered Source Synchronous I/O

　　• DDR registers in I/O cells

　　• Dedicated read/write levelling functionality

　　• Dedicated gearing logic

　　• Source synchronous standards support • ADC/DAC, 7:1 LVDS, XGMII

　　• High Speed ADC/DAC devices

　　• Dedicated DDR2/DDR3 and LPDDR2/LPDDR3 memory support with DQS logic, up to 800 Mb/s data-rate

　　• Programmable sysI/O™ Buffer Supports Wide Range of Interfaces

　　• On-chip termination

　　• LVTTL and LVCMOS 33/25/18/15/12

　　• SSTL 18/15 I, II

　　• HSUL12

　　• LVDS, Bus-LVDS, LVPECL, RSDS, MLVDS

　　• subLVDS and SLVS, MIPI D-PHY input interfaces

　　• Flexible Device Configuration

　　• Shared bank for configuration I/Os

　　• SPI boot flash interface

　　• Dual-boot images supported

　　• Slave SPI

　　• TransFR™ I/O for simple field updates

　　• Single Event Upset (SEU) Mitigation Support

　　• Soft Error Detect – Embedded hard macro

　　• Soft Error Correction – Without stopping user operation

　　• Soft Error Injection – Emulate SEU event to debug system error handling

　　• System Level Support

　　• IEEE 1149.1 and IEEE 1532 compliant

　　• Reveal Logic Analyzer

　　• On-chip oscillator for initialization and general use

　　• 1.1 V core power supply

　　ECP5/ECP5-5G系列型号选择表:

　　图1.ECP5/ECP5-5G系列LFE5UM/LFE5UM5G-85器件简化框图

　　视频接口协议(VIP)处理器板

　　This document describes the Lattice Semiconductor ECP5 VIP Processor Board which is a key component of Lattice’sVideo Interface Protocol (VIP) board interconnect. Lattice VIP boards can be interconnected to create solutions forMIPI® CSI-2/DSI, SERDES, LVDS and more.

　　The content of this user guide includes descriptions of onboard jumper settings, programming circuit, a complete set ofschematics, and bill of materials for ECP5 VIP processor board.

　　ECP5 VIP处理器板主要特性:

　　ECP5/5G

　　SERDES interface

　　Dual DDR3 interface

　　LVDS/MIPI Transmitter/Receiver interface

　　SPI flash configuration

　　General Purpose Input/Output

　　Programming Circuit

　　Mini-B USB connector to FTDI

　　FTDI to ECP5 using JTAG

　　FTDI to ispClock using JTAG

　　ispClock

　　SERDES reference clock generation interface

　　图2.ECP5 VIP处理器板外形图和主要元件分布图(正面)

　　图3.ECP5 VIP处理器板外形图和主要元件分布图(背面)

　　ECP5 VIP处理器板材料清单:

　　详情请见:

FPGA-EB-02001.pdf

DS1044.pdf