原标题：Lattice iCE40UltraPlus FPGA系列移动开发平台(MDP)方案

　　lattice公司的iCE40UltraPlus FPGA系列是超低功耗FPGA和传感器管理器,具有大电流IR LED驱动器,1Mb SRAM,DSP区块,以及其它查找表(LUT),支持移动设备的常开语音识别功能.器件具有灵活的逻辑架构,其中两个器件的LUT从2800到5280,提供WLCS和QFN封装,采用先进的40nm低功耗技术,待机电流低到100 μA,主要用在常开的语音识别应用,智能手机,平板电脑,手持消费类电子,手持通信和工业设备,多传感器管理,传感器预处理和传感器融合,常开传感器应用以及USB 3.1 Type C电缆检测/电源供给.本文介绍了iCE40UltraPlus FPGA系列主要特性,框图,sysDSP功能框和DSP框图,以及iCE40 UltraPlus移动开发平台(MDP)板主要特性,框图,电路图和材料厂清单.

　　iCE40UltraPlus family from Lattice Semiconductor is an ultra-low power FPGA and sensor manager designed for ultra-low power mobile applications, such as smartphones, tablets and hand-held devices. iCE40UltraPlus is compatible with Lattice’s iCE40 Ultra family devices, containing all the functions iCE40 Ultra family has except the high current IR LED driver. In addition, the iCE40 UltraPlus features an additional 1 Mb SRAM, additional DSP blocks, with additional LUTs, all which can be used to support an always-on Voice Recognition function in the mobile devices, without the need to keep the higher power consuming voice codec on all the time.

　　The iCE40 UltraPlus family includes integrated SPI and I2C blocks to interface with virtually all mobile sensors and application processors. In addition, the iCE40 UltraPlus family also features two I/O pins that can support the interface to I3C devices. There are two on-chip oscillators, 10 kHz and 48 MHz, the LFOSC (10 kHz) is ideal for low power function in always-on applications, while HFOSC (48 MHz) can be used for awaken activities.

　　The iCE40 UltraPlus family also features DSP functional block to off-load Application Processor to pre-process information sent from the mobile device, such as voice data. The RGB PWM IP, with the three 24 mA constant current RGB outputs on the iCE40 UltraPlus provides all the necessary logic to directly drive the service LED, without the need of external MOSFET or buffer.

　　The iCE40 UltraPlus family of devices are targeting for mobile applications to perform all the functions in iCE40 Ultra devices, such as Service LED, GPIO Expander, SDIO Level Shift, and other custom functions. In addition, the iCE40 UltraPlus family devices are also targeting for Voice Recognition application.

　　The iCE40 UltraPlus family features two device densities, 2800 to 5280 Look Up Tables (LUTs) of logic with programmable I/Os that can be used as either SPI/I2C interface ports or general purpose I/O’s. Two of the iCE40 UltraPlus I/Os can be used to interface to higher performance I3C. It also has up to 120 kb of Block RAMs, plus 1024 kb of Single Port SRAMs to work with user logic.

　　Low power connectivity and computing – With the rising complexity of systems used to power smart homes, factories and cities, iCE40 UltraPlus FPGA can solve connectivity issue with wide variety of interfaces and protocols and provide the low power computational resources for higher levels of intelligence.

　　Edge Intelligent FPGA – iCE40 UltraPlus FPGA with 5K lookup tables (LUTs) is able to implement Neural Networks for pattern matching necessary to bring always on intelligence to the edge. Optimized for best in class power, designers can eliminate latency associated with cloud intelligence while keeping the overall system solution cost low.

　　Flexible Package Options – Multiple package are available to fit wide range of applications needs. From ultra-small 2.15 mm x 2.50 mm x 0.45 mm WLCSP package optimized for consumer and IoT devices to 0.5mm pitch 7x7mm QFN for cost optimized applications.

　　Features

　　Flexible logic architecture with 2800 or 5280 4 input LUTs, customizable I/Os, up to 80 Kbits of embedded memory and 1 Mbit of embedded memory

　　Ultra-low power advanced process with sleep current as low as 75uA and 1-10mA active current for most applications

　　High performance signal processing using DSP blocks with multiply and accumulate functions

　　Soft Neural Network IPs and compiler for flexible Machine Learning/AI implementation

　　FPGA design tools, demos and reference designs to kick start designs

　　iCE40UltraPlus FPGA主要特性:

　　 Flexible Logic Architecture

　　 Two devices with 2800 to 5280 LUTs

　　 Offered in WLCS and QFN packages

　　 Ultra-low Power Devices

　　 Advanced 40 nm low power process

　　 As low as 100 μA standby current typical

　　 Embedded Memory

　　 Up to 1024 kb Single Port SRAM

　　 Up to 120 kb sysMEM™ Embedded Block RAM

　　 Two Hardened I2C Interfaces

　　 Two I/O pins to support I3C interface

　　 Two Hardened SPI Interfaces

　　 Two On-Chip Oscillators

　　 Low Frequency Oscillator – 10 kHz

　　 High Frequency Oscillator – 48 MHz

　　 24 mA Current Drive RGB LED Outputs

　　 Three drive outputs in each device

　　 User selectable sink current up to 24 mA

　　 On-chip DSP

　　 Signed and unsigned 8-bit or 16-bit functions

　　 Functions include Multiplier, Accumulator, and Multiply-Accumulate (MAC)

　　 Flexible On-Chip Clocking

　　 Eight low skew global signal resource, six can be directly driven from external pins

　　 One PLL with dynamic interface per device

　　 Flexible Device Configuration

　　 SRAM is configured through:

　　 Standard SPI Interface

　　 Internal Nonvolatile Configuration Memory (NVCM)

　　 Ultra-Small Form Factor

　　 As small as 2.15 mm × 2.55 mm

　　iCE40UltraPlus FPGA应用:

　　 Always-On Voice Recognition Application

　　 Smartphones

　　 Tablets and Consumer Handheld Devices

　　 Handheld Commercial and Industrial Devices

　　 Multi Sensor Management Applications

　　 Sensor Pre-processing and Sensor Fusion

　　 Always-On Sensor Applications

　　 USB 3.1 Type C Cable Detect / Power Delivery Applications

　　Lattice iCE40 UltraPlus移动开发平台(MDP)板

　　Thank you for choosing the Lattice iCE40 UltraPlus™ Mobile Development Platform (MDP) Board.This MDP board is an easy-to-use platform for demonstrating various features of the iCE40 UltraPlus for mobile applications. The MDP form-factor is similar to a mobile device (cell phone), with various sensors, display, Bluetooth communication, and others. The board contains four individual iCE40 UltraPlus devices, each configured with a unique set of interfaces to support multiple demonstrations.

　　iCE40 UltraPlus移动开发平台(MDP)板主要特性:

　　 Mobile Display (Onboard 1.54 inch 240 x 240 RGB wearable type display with MIPI DSI interface)

　　 Camera (Onboard VGA 640 x 480 sensor with CSI and parallel video interface option)

　　 Image and facial recognition

　　 Microphones (Onboard Dual I2S and Dual PDM microphones with audio amp, 3.5 mm and expansion connectors)

　　 Voice recognition

　　 Audio beam forming capabilities

　　 Sensors (Various Mobile Type Sensors with expansion connector)

　　 RGB LED

　　 Pressure Sensor

　　 Compass Sensor

　　 Gyroscope Sensor

　　 Accelerometer Sensor

　　This guide describes how to begin using the MDP. The contents of this user guide include top-level functional descriptions of the various portions of the evaluation board, a summary of demonstrations, descriptions of the onboard connectors, switches, jumpers, configuration options, along with a complete set of schematics and the bill of materials.

　　iCE40 UltraPlus移动开发平台(MDP)板包括:

　　 iCE40UltraPlus Mobile Development Platform– PCB, case, and integrated Li-ion battery featuring:

　　 Four iCE40 UltraPlus devices (U1-U4 iCE5UP5K-WLCSP30) in 30-Ball WLCSP packages

　　 Large capacity of onboard SPI Flash memory (U37 Micron M25P80 8Mb) to store the FPGA demo bitstream for all four iCE40 UltraPlus devices

　　 Example of a PCB design using 0.40 mm Ball Pitch package

　　 Control switches to select which of the four devices is active (only one device is active at a time)

　　 Standard USB cable for device programming (Lattice part number HW-USBN-2A, HW-USBN-2B or equivalent)

　　 RoHS-compliant packaging and process

　　 Key Components

　　 iCE40UP5K-30WLCSP (4 pieces)

　　 Power Regulation

　　 Bluetooth module

　　 MIPI LCD Mobile Display (1.54 inch 240 x 240 RGB LH154Q01)

　　 Camera image sensor OVM7692 VGA 640 x 480 (CSI and parallel video interface option)

　　 Microphones (Dual I2S and Dual PDM microphones with audio amp, connectors for 3.5 mm and expansion)

　　 RGB LED

　　 Sensors that include:

　　– Barometric pressure sensor

　　– Compass sensor

　　– 3D accelerometer and 3D gyroscope sensor

　　– Three-axis linear accelerometer sensor

　　 Pre-loaded Demo – The kit includes a pre-loaded MIPI LCD Mobile Display demo.

　　 USB Connector Cable – A mini-B USB port provides power, a programming interface and communication channel for a PC to communicate directly to iCE40 devices.

　　图.iCE40 UltraPlus移动开发平台(MDP)板外形图(正面)

　　图.iCE40 UltraPlus移动开发平台(MDP)板外形图(背面)

　　iCE40 UltraPlus移动开发平台(MDP)板材料清单:

　　详情请见:

iCE40 UltraPlus Family Data Sheet.pdf

iCE40_UltraPlus_MDP_User_Guide_FPGA-EB-02007.pdf