方案概述

　　点对点通信是使用微波(波长为0.1毫米至1米之间的电磁波)进行的通信，主要实现视距传播过程中提高传输容量及质量，因此成为无线传输和无线宽带的接入的重要手段，具有广阔的应用场景。

　　器件优势

　　• DK值稳定，插损低至0.0013的高频线路板材(Ro3003)是点对点通信功放板的参考设计板材，设计简单，生产一致性好，具有非常高的性价比.

【Ro3003】

O3003™ 高频电路材料是添加了陶瓷填料的PTFE复合材料，可以用于商业微波以及射频的应用。这个家族的产品可以提供非同一般的电气以及机械稳定性，而且价格相当有竞争力。

RO3003在随着温度变化时拥有出色的介电常数稳定性，而且去除了PTFE玻璃布材料在接近于室温的时候会出现的介电常数阶跃现象。另外，RO3003层压板在10GHz的时候还表现出非常低的介质损耗0.0013。

典型应用

汽车雷达

射频耦合器

对成本敏感的航天以及国防应用

GPS天线

Data Sheet and Processing Guidelines for RO3000® Series Bondply

Rogers RO3000® series bondply is an undensifi ed version of RO3000 laminates that can be used to process highlyreliable, homogeneous RO3000 multi-layer boards (MLB’s). The bondply is used in a manner analogous to prepreg in FR-4constructions and, once bonded, becomes the equivalent of a normal RO3000 core layer.

RO3000 series bondply offers electrical and thermal-mechanical advantages over most other adhesive systems that can beused to bond RO3000 material multi-layer constructions. In addition, improvements offered by bondply layers over core-tocorefusion bonding include improved layer-to-layer registration, tighter control over Z-axis spacing of copper layers, betterencapsulation of buried metal features at lower applied pressures, and design fl exibility.During a MLB bonding process, the bondply will reduce in thickness to about fi ve mils and closely match predictable electricalproperties. A Rogers’ Technical Support Engineer (TSE) should be contacted for design data.

PROCESSING GUIDELINES:

INNER-LAYER PREPARATION:

Cores should be processed through inner-layer as standard. If copper roughening is required (ground or power planes), amicroetch or a subtractive process oxide alternative such as Atotech’s Bondfi lm or MacDermid’s MultiBond LE should be used.

Traditional additive process oxide treatments lack the thermal stability to survive the high temperature bond conditions.PTFE activation by sodium or plasma treatment should be avoided. All inner-layers should be baked at 125°C to 150°C(257°F - 302°F) for at least one hour prior to MLB bonding.

PREPARATION OF MLB BOOK:

RO3000 bondply layers require careful handling to avoid tearing. Pinning holes can be punched, drilled, or routed. Entrymaterial should be used during drill or rout to shield the bondply layers from debris.Due to in-plane expansion characteristics, type 304 stainless steel separator plates are recommended. Five to ten mil thicksheets of aluminum should be placed between the multi-layers and the separator plates.Foil bonding of outer-layers is possible but a Rogers’ Technical Service Engineer should be consulted prior to processing foilbonded constructions.

　　• 衰减精度高(±0.75dB)，驻波<1.5的衰减器(QFA1004SMTF)，可灵活控制且芯片发热低，非常适用于点对点通信。

【QFA1004SMTF】

FEATURES

Ka and Q Band Operating Frequency

Self-Passivated Tantalum Nitride Film

Moisture Resistant

NASA-Approved Low Outgassing

Surface Mount

Pick-And-Place Compatibility

APPLICATIONS

Point-to-Point Radio

Phased Array Radar

High Frequency Transceiver

Instrumentation

Satellite

Telemetry

GENERAL DESCRIPTION

EMC Technology’s QFA series offers an easy-to-implement surface-mount fixed attenuator solution at 36 to 50 GHz. These attenuatorsfeature a small footprint and are compatible with pick-and-place assembly. QFA attenuators are available in 0 to 10 dB attenuation, in 1-dB increments. With a broad range of operating temperature, -55 to 150ºC, QFA attenuators are ideal for applications including point-topointradio, phased array radar, and high frequency transceivers. Tape-and-reel is the standard packaging for QFA series. High-reliability

SPECIFICATIONS

Frequency Range:

QFAXX04SMTF： 36 - 40 GHz

QFAXX05SMTF： 40 - 50 GHz

Attenuation Value: 0 to 10 dB (SEE SHEET 2)

Attenuation Accuracy: ± 0.75 dB

VSWR: 1.50:1 Max

Power Rating: 0.2 Watts

Operating Temperature: -55 °C To +150 °C

Storage Temperature: -55 °C To +150 °C

2.0 MECHANICAL

Substrate Alumina

Resistive Element: Thin-Film Tantalum Nitride

Termination: Thick-Film Gold

Termination Plating: Silver

3.0 UNIT MARKING

Attenuation (0 to 10 dB)

4.0 PACKAGING

Standard: Tape and Reel

5.0 PART NUMBERING

Part Identifier:

　　【点对点通信】

        点对点通信实现网内任意两个用户之间的信息交换。电台收到带有点对点通信标识信息的数据后，比较系统号和地址码，系统号和地址码都与本地相符时，将数据传送到用户终端，否则将数据丢掉，不传送到用户终端。点对点通信时，只有1个用户可收到信息。

　　点对点连接是两个系统或进程之间的专用通信链路。想象一下直接连接两个系统的一条线路。两个系统独占此线路进行通信。点对点通信的对立面是广播,在广播通信中,一个系统可以向多个系统传输。

　　电话呼叫是面向电路的两部电话机之间的点对点链路。但是,呼叫通常是通过电话公司中继线多路复用的;因此虽然电路本身可能是虚拟的,但用户在进行点对点通信会话。

　　端到端连接是指通过交换网络的两个系统间的连接。例如,因特网由路由器网状网组成。数据分组沿着逐跳路径从一个路由器到下一个路由器,一直到达目的地。每一跳都包括路由器之间的物理点对点链路。因此,一个路由路径包括多个点对点链路。在ATM和帧中继环境中,端到端路径称为虚电路,它穿越一组预定义的点对点链路。

　　共享的LAN,如以太网,提供了一种点对点通信的形式。请记住,在共享的LAN上,所有的节点都在监听缆路上的信号,因此支持广播。但是,当一个节点向另一节点发送帧时,只有那个节点接收到帧,可以说两个节点通过共享媒体进行点对点通信。

　　通过多点链路的点到多点连接是可能的。多点是指信号由基站到用户端是以点到多点的方式传送的，而信号由用户端到基站则是以点对点的方式传送的。大型机和它的终端就是一个例子。提供多点连接的设备通常是一个智能控制器,它管理来自与它相连的多个设备的信息流。

　　点对点通信是基于OSI协议栈的物理和数据链路层和网络层中定义。