The Cypress CYW20706 is a single-chip Bluetooth 4.1-compliant, embedded SoC with an integrated baseband processor, a 2.4 GHztransceiver, an ARM Cortex M3, ROM and RAM, as well as an integrated Bluetooth stack. Manufactured using an advanced 40 nm　CMOS low-power process, the CYW20706 employs high levels of integration reduce external components, thereby minimizing thedevice’s footprint and the costs associated with implementing Bluetooth solutions.

　　The CYW20706 is the optimal solution for embedded and IoT applications. Built-in ROM firmware provides access to both BluetoothLow Energy (SMART) and Bluetooth Classic (SMART READY).

　　The CYW20706 microprocessor unit (MPU) runs software from the link control (LC) layer up to the host controller interface (HCI). Inaddition, the MPU supports the running of application layer code that interfaces to the HCI layer. The microprocessor is based on the　Cortex-M3 32-bit RISC processor with embedded ICE-RT debug and JTAG interface units. The microprocessor also includes 848 KBof ROM memory for boot ROM and 352 KB of RAM for data scratch-pad, patch RAM code, and application code.

　　The internal boot ROM provides flexibility during power-on reset to enable the same device to be used in various configurations. Atpower-up, the lower layer protocol stack is executed from the internal ROM.

　　External patches can be applied to the ROM-based firmware to provide flexibility for bug fixes and features additions. These patchescan be downloaded using external NVRAM. The device can also support the integration of user applications and profiles using an external serial flash memory.

　　CYW20706主要特性:

　　■ Up to 96 MHz integrated ARM M3 micro-controller

　　■ Integrated PA with up to +12 dBm output power

　　■ Integrated peripherals such as PWM, ADC, Triac control

　　■ Complies with Bluetooth Core Specification version 4.1including BR/EDR/BLE

　　■ Supports Cypress proprietary data rates up to 2 Mbps

　　■ Supports Adaptive Frequency Hopping (AFH)

　　■ Excellent receiver sensitivity

　　■ Programmable output power control

　　■ On-chip power-on reset (POR)

　　■ Support for serial flash interfaces

　　■ Integrated low dropout regulators (LDO)

　　■ On-chip software controlled power management unit

　　■ PCM/I2S Interface

　　■ Infrared modulator

　　■ IR learning

　　■ On-chip support for serial peripheral interface (master andslave modes)

　　■ Broadcom Serial Communications (BSC) interface (compatiblewith NXP I2C slaves and MFI authentication co-processor)

　　■ Package type:

　　❐49-pin FBGA Package (4.5 mm x 4.0 mm)

　　❐RoHS compliant

　　CYW20706应用:

　　■ Home automation

　　■ Point-of-sale input devices

　　■ Blood pressure monitors

　　■ “Find me” devices

　　■ Heart rate monitors

　　■ Proximity sensors

　　■ Thermometers

　　■ Wearables

　　图1.CYW20706功能框图

　　评估板CYW920706WCDEVAL

　　The Cypress CYW920706WCDEVAL board is an evaluation board that provides various pins, jumpers, switches, ports, and test points to access CYW20706 to perform debug, evaluation, and troubleshooting.

　　The Cypress CYW920706WCDEVAL Evaluation Kit enables you to evaluate and develop single-chip Bluetooth applications using the CYW20706 device. The Cypress CYW20706 is a single-chip Bluetooth 4.2-compliant, stand-alone baseband processor with an integrated 2.4 GHz transceiver. This kit helps evaluate device functionality and develop applications quickly for faster time-to-market.

　　图2.评估板CYW920706WCDEVAL外形图

　　图3.评估板CYW920706WCDEVAL框图

　　图4.评估板CYW920706WCDEVAL电路图(1):基带

　　图5.评估板CYW920706WCDEVAL电路图(2):RF

　　图6.评估板CYW920706WCDEVAL电路图(3):电源和插头

　　图7.评估板CYW920706WCDEVAL电路图(4):USB到 RT接口

　　图8.评估板CYW920706WCDEVAL PCB布局和元件分布图

　　Cypress公司是一家知名的电子芯片制造商，其中文名称为——赛普拉斯。 赛普拉斯在纽约股票交易所上市，在数据通信、消费类电子等广泛领域均提供芯片解决方案。

　　Cypress半导体公司生产高性能IC产品，用于数据传输、远程通讯、PC和军用系统。公司1982年成立，是一家国际化大公司。目前约有人员3000人，已经在全球建立了销售网络。公司总部设在美国加州San Jose。

　　公司的生产据点包括：

　　据点1：在加州圣约瑟市，是公司的第一个工厂和现在的研发基地。

　　据点2：在德克萨斯州Round Rock，1986年建立，生产SRAM产品。

　　据点3：Cypress Semiconductor Philippines Inc.(CSPI),是公司在菲律宾设立的组装、检测工厂，1996年投入生产，此外在印尼也有同类的工厂。

　　除了在加州硅谷拥有最早的设计中心之外，公司在美国的科罗拉多州、华盛顿、俄勒冈州、明尼苏达州、肯塔基、新汉普郡及英格兰、爱尔兰、菲律宾也设有设计工厂。1987年开始采用0.8微米CMOS工艺技术，1992年转移至0.65微米，不久将引入0.21微米工艺，现在70%以上的产品使用0.35微米或以下的工艺制造的。目前，Cypress半导体公司的新战略是瞄准大容量半导体市场，为此采取了一系列新步骤：将产品组装、检测转移至海外，减少产品/封装数量，改良生产设备等，以提高生产效率、缩短产品上市周期。

　　赛普拉斯(Cypress)为消费类电子、计算、数据通信、汽车、工业和太阳能等系统核心部分提供高性能的解决方案。赛普拉斯致力于客户服务，充分利用基于产品性能的工艺以及制造技术专长，使其产品系列扩展到有线与无线USB器件、CMOS图像传感器、计时技术解决方案、网络搜索引擎、专业存储器、高带宽同步和微功耗存储器产品、光学解决方案以及可再配置的混合信号阵列等。赛普拉斯股票在纳斯达克挂牌上市交易，代号为CY。

　　详情请见:

002-15269_CYW20706_Bluetooth_SoC_for_Embedded_Wireless_Devices.pdf

20171011105336885.zip

CYW920706WCDEVAL Evaluation Kit Hardware User Guide.pdf