原标题：TI AM574x系列Sitara TM处理器开发方案

　　TI公司的AM574x系列Sitara™应用处理器是基于双核Arm Cortex-A15 RISC CPU,并提供两个TI C66x VLIW浮点DSP核.ARM允许开发人员控制不同于DSP和协处理器编程算法的功能,从而降低了系统软件的复杂性.主要用在工业自动化,人机接口(HMI),工业通信,高性能应用和其它通用应用.本文介绍了AM574x系列主要特性,AM574x系列框图以及评估板AM572x IDK EVM主要特性,框图,电路图,材料清单.

　　AM574x Sitara Arm applications processors are built to meet the intense processing needs of modernembedded products.

　　AM574x devices bring high processing performance through the maximum flexibility of a fully integratedmixed processor solution. The devices also combine programmable video processing with a highlyintegrated peripheral set. Cryptographic acceleration is available in every AM574x device.

　　Programmability is provided by dual-core Arm Cortex-A15 RISC CPUs with Neon™ extension, and two TIC66x VLIW floating-point DSP cores. The Arm allows developers to keep control functions separate fromother algorithms programmed on the DSPs and coprocessors, thus reducing the complexity of the systemsoftware.

　　Additionally, TI provides a complete set of development tools for the Arm and C66x DSP, including Ccompilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interfacefor visibility into source code execution.

　　Cryptographic acceleration is available in all devices. All other supported security features, includingsupport for secure boot, debug security and support for trusted execution environment are available onHigh-Security (HS) devices. For more information about HS devices, contact your TI representative.

　　AM574x系列主要特性:

　　• Dual Arm® Cortex®-A15 MicroprocessorSubsystem

　　• Up to two C66x Floating-Point VLIW DSP

　　– Fully Object-Code Compatible With C67x andC64x+

　　– Up to Thirty-two 16 × 16-Bit Fixed-PointMultiplies per Cycle

　　• Up to 2.5MB of On-Chip L3 RAM

　　• Two DDR3/DDR3L Memory Interface (EMIF)Modules

　　– Supports rates up to DDR3-1333

　　– Up to 2GB Supported per EMIF

　　– ECC supported on primary EMIF

　　• 2x Dual Arm® Cortex®-M4 co-processors (IPU1and IPU2)

　　• IVA-HD Subsystem

　　– 4K @ 15fps encode and decode support forH.264 CODEC

　　– Other CODECs are up to 1080p60

　　• Display Subsystem

　　– Full-HD Video (1920 × 1080p, 60 fps)

　　– Multiple Video Input and Video Output

　　– 2D and 3D Graphics

　　– Display Controller With DMA Engine and up toThree Pipelines

　　– HDMI™ Encoder: HDMI 1.4a and DVI 1.0Compliant

　　• 2x Dual-Core Programmable Real-Time Unit andIndustrial Communication Subsystem (PRU-ICSS)

　　• 2D-Graphics Accelerator (BB2D) Subsystem

　　– Vivante® GC320 Core

　　• Video Processing Engine (VPE)

　　• Dual-Core PowerVR® SGX544 3D GPU

　　• Secure Boot support

　　– Hardware-enforced Root-of-trust

　　– Customer programmable keys and OTP data

　　– Support for Takeover protection, IP protection,and anti-roll back protection

　　• Cryptographic Acceleration support

　　– Supports cryptographic cores

　　– AES – 128/192/256-bits key sizes

　　– 3DES – 56/112/168-bits key sizes

　　– MD5, SHA1

　　– SHA2 – 224/256/384/512

　　– True Random number generator

　　– DMA support

　　• Debug security

　　– Secure software controlled debug access

　　– Security aware debugging

　　• Trusted Execution Environment (TEE) support

　　– Arm TrustZone based TEE

　　– Extensive Firewall support for isolation

　　– Secure DMA path and interconnect

　　– Secure watchdog/timer/IPC

　　• Two Video Input Port (VIP) Modules

　　– Support for up to eight Multiplexed Input Ports

　　• General-Purpose Memory Controller (GPMC)

　　• Enhanced Direct Memory Access (EDMA)Controller

　　• 2-Port Gigabit Ethernet (GMAC)

　　• Sixteen 32-Bit General-Purpose Timers

　　• 32-Bit MPU Watchdog Timer

　　• Five Inter-Integrated Circuit (I2C) Ports

　　• HDQ™/ 1-Wire ® Interface

　　• Ten Configurable UART/IrDA/CIR Modules

　　• Four Multichannel Serial Peripheral Interfaces(McSPI)

　　• Quad SPI Interface (QSPI)

　　• SATA Gen2 Interface

　　• Eight Multichannel Audio Serial Port (McASP)Modules

　　• SuperSpeed USB 3.0 Dual-Role Device

　　• High-Speed USB 2.0 Dual-Role Device

　　• Four MultiMedia Card/Secure Digital/Secure DigitalInput Output Interfaces ( MMC™/ SD™/SDIO)

　　• PCI Express® 3.0 Subsystems With Two 5-GbpsLanes

　　– One 2-lane Gen2-Compliant Port

　　– or Two 1-lane Gen2-Compliant Ports

　　• Up to two Controller Area Network (DCAN)Modules

　　– CAN 2.0B Protocol

　　• Modular Controller Area Network (MCAN) Module

　　– CAN 2.0B Protocol with available FD(Flexible Data Rate) functionality

　　• Up to 247 General-Purpose I/O (GPIO) Pins

　　• Power, Reset, and Clock Management

　　• On-Chip Debug With CTools Technology

　　• 28-nm CMOS Technology

　　• 23 mm × 23 mm, 0.8-mm Pitch, 760-Pin BGA(ABZ)

　　AM574x系列应用:

　　• Industrial Communication

　　• Human Machine Interface (HMI)

　　• Automation and Control

　　• High Performance Applications

　　• Other General Use

　　图1. AM574x系列框图

　　评估板AM572x IDK EVM

　　This document describes the hardware architecture of the AM572x Industrial Development Kit (IDK)

　　Evaluation Module (EVM) (Part# TMDXIDK572x) that supports the Texas Instruments Sitara™ ARM®Cortex®-A15 AM572x processor family.

　　The AM572x IDK is a standalone test, development, and evaluation module that enables developers towrite software and develop hardware for industrial control and industrial communications applications. Ithas been equipped with a TI AM5728 processor and a defined set of features to allow you to experienceindustrial communication solutions using various serial or Ethernet based interfaces. Using standardinterfaces, the AM572x IDK may interface to other processors or systems and act as a communicationgateway or controller. In addition, it can directly operate as a standard remote I/O system or a sensor connected to an industrial communication network.

　　The AM572x IDK contains embedded emulation circuitry to quickly enable developers to begin using thisIDK. The embedded emulation logic allows emulation and debug using standard development tools suchas the Texas Instruments Code Composer Studio™ integrated development environment (IDE) by simplyconnecting a USB cable to a Windows®-based computer.

　　The standard configuration for the AM572x IDK EVM provides the following Ethernet connectivity:

　　• Two Gigabit (1000Mb) metallic ports connected via PHY/RGMII to the on-chip Ethernet switch

　　• Two 100Mb metallic ports connected via PHY/MII to the PRU-ICSS subsystems Reconfiguration through resistor removal and installation can provide an alternate Ethernet connectivity:

　　• Four 100Mb metallic ports connected via PHY/MII to the PRU-ICSS subsystems Software support for the AM572x IDK EVM is provided within the Processor Software Development Kit(SDK) package. This includes both Linux and RTOS support.

　　The system view of the AM572x IDK EVM consists of the main board and the camera board. There is alsoan optional LCD panel and touch screen assembly that can be attached to the AM572x IDK EVM.

　　图2.评估板AM572x IDK EVM外形图(顶视)

　　图3.评估板AM572x IDK EVM外形图(底视)

　　图4.评估板AM572x IDK EVM框图

　　评估板AM572x IDK EVM材料清单: