原标题：红外非接触式测温仪解决方案

　　1. 简介

　　任何物体当它的温度高于绝对零度时，都向外辐射红外线。红外线是一种电磁波，具有很强的温度效应，其能量的大小与物体表面的温度有着十分密切的关系。红外非接触式传感器能够吸收红外线能量并输出一个与温度成比例关系的电压信号。其工作原理类似于热电偶，基于塞贝克效应(温差电势效应)。先在硅基片上沉淀出多个热偶接点(thermojunction)。这些热偶接点串联在一起形成一个热感应通道(thermopile)。一端(热端)与另一端(冷端)之间通过腐蚀方法形成的非常薄的薄膜进行热隔离。红外吸收区域与热端合并在一起以使热端能升温，这样，与红外线能量成正比的热电势便可产生。

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　　铭为公司的EK200产品开发学习系统，使用TS118作为红外传感器，带有详尽的软硬件设计方案，以多媒体光盘的形式整合在一起，由浅入深、循序渐进地介绍非接触式红外测温仪的设计方法。

　　2. 技术指标

　　3. 工作原理

　　本系统使用STM32F103V8T6单片机，它有以下优点：

　　1. 32位的CORTEX-M3内核，采用高密度指令集，具有单周期乘法和硬件除法

　　2. 低功耗，3种省电模式

　　3. 带USB接口

　　4. 7通道的DMA控制器

　　5. 12位快速数模转换器，1us的转换时间

　　6. 带校准功能的RTC实时时钟

　　7. 多达80个快速IO和9个通讯接口

　　4. 产品应用

　　红外非接触式测温的设计、开发、原型机制作。

　　【STM32F103V8T6】

　　Mainstream Performance line, ARM Cortex-M3 MCU with 64 Kbytes Flash, 72 MHz CPU, motor control, USB and CAN

　　The STM32F103xx medium-density performance line family incorporates the high-performance ARM®Cortex®-M3 32-bit RISC core operating at a 72 MHz frequency, high-speed embedded memories (Flash memory up to 128 Kbytes and SRAM up to 20 Kbytes), and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All devices offer two 12-bit ADCs, three general purpose 16-bit timers plus one PWM timer, as well as standard and advanced communication interfaces: up to two I2Cs and SPIs, three USARTs, an USB and a CAN.

　　The devices operate from a 2.0 to 3.6 V power supply. They are available in both the –40 to +85 °C temperature range and the –40 to +105 °C extended temperature range. A comprehensive set of power-saving mode allows the design of low-power applications.

　　The STM32F103xx medium-density performance line family includes devices in six different package types: from 36 pins to 100 pins. Depending on the device chosen, different sets of peripherals are included, the description below gives an overview of the complete range of peripherals proposed in this family.

　　These features make the STM32F103xx medium-density performance line microcontroller family suitable for a wide range of applications such as motor drives, application control, medical and handheld equipment, PC and gaming peripherals, GPS platforms, industrial applications, PLCs, inverters, printers, scanners, alarm systems, video intercoms, and HVACs.

　　KEY FEATURES

　　ARM®32-bit Cortex®-M3 CPU Core

　　72 MHz maximum frequency,1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access

　　Single-cycle multiplication and hardware division

　　Memories

　　64 or 128 Kbytes of Flash memory

　　20 Kbytes of SRAM

　　Clock, reset and supply management

　　2.0 to 3.6 V application supply and I/Os

　　POR, PDR, and programmable voltage detector (PVD)

　　4-to-16 MHz crystal oscillator

　　Internal 8 MHz factory-trimmed RC

　　Internal 40 kHz RC

　　PLL for CPU clock

　　32 kHz oscillator for RTC with calibration

　　Low-power

　　Sleep, Stop and Standby modes

　　VBAT supply for RTC and backup registers

　　2 x 12-bit, 1 μs A/D converters (up to 16 channels)

　　Conversion range: 0 to 3.6 V

　　Dual-sample and hold capability

　　Temperature sensor

　　DMA

　　7-channel DMA controller

　　Peripherals supported: timers, ADC, SPIs, I2Cs and USARTs

　　Up to 80 fast I/O ports

　　26/37/51/80 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant

　　Debug mode

　　Serial wire debug (SWD) & JTAG interfaces

　　7 timers

　　Three 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input

　　16-bit, motor control PWM timer with dead-time generation and emergency stop

　　2 watchdog timers (Independent and Window)

　　SysTick timer 24-bit downcounter

　　Up to 9 communication interfaces

　　Up to 2 x I2C interfaces (SMBus/PMBus)

　　Up to 3 USARTs (ISO 7816 interface, LIN, IrDA capability, modem control)

　　Up to 2 SPIs (18 Mbit/s)

　　CAN interface (2.0B Active)

　　USB 2.0 full-speed interface

　　CRC calculation unit, 96-bit unique ID

　　Packages are ECOPACK®

　　Circuit Diagram