原标题：一拖多蓝牙音频解决方案

　　基于高通CSR8670/8675一拖多蓝牙音频解决方案，通过广播形式协议来实现一个主设备广播给多个从设备。在该方案中，平时主蓝牙音频设备单个使用时，可以连接手机播放音乐等功能;切换到做主设备既可连接蓝牙流设备(如手机)，也可接收LINE—IN输入，并且同时转发给一个或多个从设备。该方案还支持蓝牙RF CLASS 1，最大距离可以达到100米。

　　一拖多蓝牙音频解决方案的系统方案图

　　方案特色

　　· Supports HFP 1.6，SP 1.2，2DP 1.3，PP 1.2，VRCP 1.6

　　· Supports Bluetooth(BR/EDR/BLE)specifications

　　· Supports high resolution up to 24-bit，kHz I2S

　　·Supports RF Class 1/2(MAX 15dBm)

　　图示2-IS2064GM-SIG认证的V4.2规格双模蓝牙SOC

　　方案应用

　　· Soundbar and Subwoofer

　　· 蓝牙音响

　　· Multi-speaker

　　【CSR8670 Bluetooth Audio SoC】

　　Embedded Flash Solution for Bluetooth Audio Applications

　　The CSR8670 SoC is an audio system-on-chip (SoC) solution with wireless connectivity, embedded flash memory and integrated capacitive touch sensors, enabling the creation of feature rich home entertainment and wearable audio products with a highly compelling user experience and superior audio performance.

　　Specifications

　　Bluetooth

　　Bluetooth Version: Bluetooth 5.0

　　Bluetooth Radio: +10dBm maximum output power (typical), -90dBm receiver sensitivity (basic rate, typical)

　　USB

　　USB Support: Supports USB charger detection

　　USB Version: USB 2.0 (Full Speed)

　　General Audio

　　Audio Technology: Qualcomm TrueWireless™ Technology, Qualcomm® Broadcast Audio technology, Qualcomm® aptX™ audio technology, Qualcomm® cVc™ audio technology, 16 bit audio data path

　　Qualcomm® aptX™ playback support: aptX Classic, Qualcomm® eXtension program

　　Analog Microphone Input: 2 analog mics/line inputs (up to 96kHz sample rate)

　　Digital Microphone Input: 6 digital mics

　　Analog DAC output: 2 analog DAC channels (up to 192kHz sample rate)

　　Microphone Bias Generator: 2 microphone bias generators

　　DSP

　　DSP Technology: Qualcomm® Kalimba™ DSP

　　DSP Clock Speed: 80 MHz

　　MCU

　　MCU Clock Speed: 80MHz

　　Power Management

　　Maximum Input Voltage: 3.3V

　　Charging

　　Maximum Current: 200 mA on chip, 500 mA with external transistor

　　Memory

　　Flash: 16MB, Up to 64 MB external flash

　　RAM: 56KB RAM

　　Interface

　　Supported Interfaces: Master I²C, 1x PCM/I²S, 1x SPDIF, UART

　　Input/Output

　　ADC: 2 ADCs

　　DAC: 2 DACs

　　Maximum PIOs: 29

　　PWM (LED): 3

　　Input

　　Touch Sensor Inputs: 6 touch sensor inputs

　　Package

　　Package Type: VFBGA, WLCSP, 4.7 x 4.8 x 0.6 mm 0.5 mm pitch WLCSP, 6.5 x 6.5 x 1 mm 0.5 mm pitch VFBGA

　　Pitch: 0.5mm Pitch

　　【CSR8675 Bluetooth Audio SoC】

　　Embedded Flash Solution for Premium Bluetooth Audio Applications

　　CSR8675 is a premium tier single-chip solution delivering high quality wireless audio performance and supporting the development of highly differentiated premium wireless audio products. Integrated support for aptX, aptX HD, Active Noise Cancellation and Qualcomm TrueWireless stereo.

　　Specifications

　　Bluetooth

　　Bluetooth Version: Bluetooth 5.0

　　Bluetooth Radio: +10dBm maximum output power (typical), -90dBm receiver sensitivity (basic rate, typical)

　　USB

　　USB Support: Supports USB charger detection

　　USB Version: USB 2.0 (Full Speed)

　　General Audio

　　Audio Technology: Qualcomm TrueWireless™ Technology, Qualcomm® Broadcast Audio technology, Qualcomm® aptX™ audio technology, Qualcomm® cVc™ audio technology, 24 bit audio data path

　　Qualcomm® aptX™ playback support: aptX Classic, aptX HD, Qualcomm® eXtension program

　　Analog Microphone Input: 2 analog mics/line inputs (up to 96kHz sample rate)

　　Digital Microphone Input: 6 digital mics

　　Analog DAC output: 2 analog DAC channels (up to 192kHz sample rate)

　　Microphone Bias Generator: 2 microphone bias generators

　　DSP

　　DSP Technology: Qualcomm® Kalimba™ DSP

　　DSP Clock Speed: 80 MHz

　　Charging

　　Maximum Current: 200 mA on chip, 500 mA with external transistor

　　Memory

　　Flash: 16 Mb internal flash, Up to 64 Mb external flash

　　Interface

　　Supported Interfaces: Master I²C, 2x PCM/I²S, 2x SPDIF, UART

　　Input/Output

　　ADC: 2 ADCs

　　General Purpose IOs: 32

　　DAC: 2 DACs

　　PWM (LED): 3

　　Input

　　Touch Sensor Inputs: 6 touch sensor inputs

　　Package

　　Package Type: VFBGA, WLCSP, 4.8 x 4.8 x 0.6 mm 0.5 mm pitch WLCSP, 6.5 x 6.5 x 1 mm 0.5 mm pitch VFBGA

　　Pitch: 0.5mm Pitch