基于QUALCOMM QCA4020+CSR1025的Mesh智能灯控系统解决方案
原标题:基于QUALCOMM QCA4020+CSR1025的Mesh智能灯控系统解决方案
智能照明作为智能家居的重要组成部分,在智慧城市和智能家居的双驱动力之下进入了全新的发展阶段,给传统的LED照明行业带来翻天覆地的改变。蓝牙mesh智能灯控作为智能灯控方案中重要一类在市场上已经得到广泛认同。
目前推出的基于QUALCOMM QCA4020+CSR1025 Mesh智能灯控系统解决方案就是其中最新的一个选择。作为QCA4531+CSR1010Mesh灯方案的升级版,本方案已经支持到最新的SIG Mesh规格,芯片原生支持双模WIFI,BLE MESH,ZIGBEE。
场景应用图
产品实体图
展示板照片
方案方块图
核心技术优势
1、WIFI SAP、STA模式
2、兼容SIG Mesh1.0、QMesh标准
3、支持Zigbee3.0
4、支持BLE5.0
5、高通无线共存技术
方案规格
1、 Arm M0M4双核处理器
2、 完整网络协议支持IPV4IPV6
3、 支持Azure、aws
4、 支持freertos、thread系统
【QCA4020】
Multi-mode intelligent connectivity solution integrating dual-band Wi-Fi, Bluetooth 5 and 802.15.4 technology.
The QCA4020 SoC is a multi-mode system-on-chip with support for dual-band Wi-Fi, Bluetooth 5 and 802.15.4-based technologies, including Zigbee and Thread. This low power SOC integrates a Cortex M4F for application processing, Cortex M0 for network stack processing, and a separate processor for Wi-Fi stack designed to enable a highly concurrent multiple radio solution. The QCA4020 SDK from Qualcomm Technologies pre-integrates support for advanced security features and multiple software / cloud ecosystems. Designed to address IoT fragme....
Multi-mode intelligent connectivity
QCA4020 supports integrated Bluetooth 5 and Qualcomm® Mesh connectivity; low power Wi-Fi 802.11n in 2.4GHz/5GHz bands and 802.15.4 which supports ZigBee3.0 and Thread via OpenThread.
Multi-core processing
Dedicated Arm Cortex-M4F CPU for customer applications and low power Arm Cortex-M0 CPU for BLE/802.15.4 protocol and Xtensa-based Wi-Fi CPU to offload Wi-Fi stack.
Hardware-based security features
QCA4020 includes hardware-based security features and functions integrated in a single IC, and provides OEMs with the option of replacing external security chips for potential cost savings.
Features
Multi-mode SOC supporting dual band Wi-Fi, Bluetooth 5, and IEEE 802.15.4 concurrently
Dedicated processor for Bluetooth LE LC and 15.4 MAC
Dedicated processor for 802.11 a/b/g/n
Zigbee 3.0 and OpenThread support
Isolated power islands for low power operation
Advanced hardware-based security featuring secure boot, trusted execution environment, encrypted storage, key provisioning and application level security
Comprehensive set of peripherals and interfaces: SPI, UART, PWM, I2S, I2C, SDIO, ADC and GPIOs
Integrated sensor hub for post-processing designed to enable low power sensor use cases
Small package size allows for optimized form factors
300+KB RAM reserved for applications
Bluetooth radio details: v5.0 with PA =+4dBm/+10dBm (for Long Range)
802.15.4 radio details: 2006 compliant, 15.4e, 2.4GHz DSSS +4dBm/+21dBm (for Long Range)
Specifications
CPU
CPU Clock Speed: Up to 128 MHz
CPU Cores: Arm Cortex-M4F CPU
Wi-Fi
Wi-Fi Standards: 802.11a/b/g, 802.11n
Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz
MIMO Configuration: 1x1 (1-stream)
Bluetooth
Bluetooth Version: Bluetooth 5.0
Bluetooth Technology: Bluetooth Low Energy, Qualcomm Bluetooth mesh
802.15.4
LR-WPAN Protocol: Zigbee, Thread
USB
USB Version: USB 2.0
Security Support
Security Features: H/W based Crypto Engine, Secure Storage, Software Image Encryption, 16-Bit True Random Number Generator, Application Level Security, Key Provisioning Security, Qualcomm® Trusted Execution Environment, Secure Boot
Wi-Fi Security: WPS
Interface
Supported Interfaces: ADC, SPI/Q-SPI, SDIO2.0, I²S, PWM, I²C, GPIO, SPI, UART
Package
Ball: 217-ball
Package Type: BGA
Pitch: 0.65mm Pitch
Package Size: 11.2 x 11.2 mm
【CSR1025 Chipset】
CSR1025 LGA is a Qualcomm® Bluetooth® Low Energy technology single‑mode platform device with ultra low power consumption. CSR1025 LGA enables customer applications of up to 60 KB to be stored on chip for optimal power consumption.
Specifications
MCU
MCU Bit Architecture: 16-bit
Bluetooth
Bluetooth Version: Bluetooth 4.2
Bluetooth Technology: Bluetooth Low Energy, CSRmesh™ technology
Maximum Output Power: Up to +4dBm
Bluetooth Radio: -90.5dBm receiver sensitivity, 50Ω
Bluetooth RF Ports: 1
General Audio
Digital Microphone Input: 1 digital mic
Power Management
Maximum Input Voltage: 3.6V
Memory
MTP: 256B
Flash: 256KB Flash
RAM: 80KB RAM
Interface
Supported Interfaces: I²S, PDM, I²C, SPI, UART
Input/Output
Analog I/O: 2
ADC: 1 ADC, 10-bit
General Purpose IOs: 33
PWM (LED): 5
Quadrature Decoder: 4 Quadrature Decoder
Operating Temperature Range
Maximum Temperature: 85°C
Minimum Temperature: -30°C
Package
Package Type: LGA
Pitch: 0.5mm Pitch
Package Size: 8 x 8 x 0.75mm
责任编辑:David
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